IPC Terms and Definitions (來源:IPC網站)

abelenatorlin · 发表于 2022-1-19 22:21:39

本帖最后由 abelenatorlin 于 2022-1-19 22:45 编辑

IPC Terms and Definitions
PCB Printed Circuit Board (Bare Board)PCBA Printed Circuit Board Assembly
QFN Quad Flatpack - No Lead
BGA Ball Grid Array
BTC Bottom Termination Component
CE Conformité Européenne (In accordance with EU Directives)
CSP Chip Scale Package
ESD Electrostatic Discharge
EMC Electromagnetic Compatibility
LCC Leadless Chip Carrier
LCCC Leadless Ceramic Chip Carrier
JEDEC Joint Electron Device Engineering Council
CAF Conductive Anodic Filament
UL Underwriters Laboratories
Tg Glass Transition Temperature
Td Laminate Temperature of Decomposition
CTE Coefficient of Thermal Expansion
Dk Dielectric Constant
CID Certified Interconnect Designer (Basic)
CID+ Certified Interconnect Designer (Advanced)
CIS Certified IPC Application Specialist
CIT Certified IPC Trainer
Pb Lead
RoHS Restriction of Hazardous Substances Directive
BOM Bill of Materials
CAD Computer Aided Design
CAM Computer Aided Manufacturing

zhangbolun · 发表于 2022-1-20 07:45:40

叶太平 · 发表于 2022-1-20 08:03:28

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billye · 发表于 2022-1-20 08:12:36

感谢分享

JXPSCD1 · 发表于 2022-1-20 08:17:34

wlw011@163.com · 发表于 2022-1-20 08:20:24

谢谢分享

aipinzhia0 · 发表于 2022-1-20 08:29:19

me412 · 发表于 2022-1-20 08:32:20

chinape · 发表于 2022-1-20 08:51:17

golfgti · 发表于 2022-1-20 09:09:11

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