IC封装常用英语汇总 Package Type Engelish

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IC封装常用英语汇总 Package Type Engelish

序号NO.	类型Type	中文Chinese	英文English
1	DIP	双列直插封装	DualIn-line package
2	eMSOP	裸露焊盘微型小外形封装	MiniatureSmall Outline Package with Exposed PAD
3	eSOP	裸露焊盘小外形封装	SmallOutline Package with Exposed PAD
4	eTSSOP	裸露焊盘窄节距薄小外形封装	ThinShrink Small Outline Package with Exposed PAD
5	eLQFP	裸露焊盘低高度四面扁平封装	Low-ProfileQuad Flat Package with Exposed PAD
6	eZIP	裸露焊盘交错直插封装	Zig-ZagIn-Line Package with Exposed PAD
7	FC	倒装封装	FlipChip
8	HDIP	带散热片双列直插封装	Heat-sinkDual In-line package
9	HSOP	带散热片小外形封装	HeatsinkSmall Outline Package
10	LQFP	低高度四面扁平封装	Low-profileQuad Flat Package
11	MSOP	微型小外形封装	MiniatureSmall Outline Package
12	MSSOP	微型窄间距小外形封装	MinimumShrink Small-Outline Package
13	QFP	四边扁平封装	QuadFlat Package
14	SDIP	窄节距双列直插式封装	ShrinkDual In-line Package
15	SKY	窄跨度双列直插式封装	SkinnyDual In-line Package
16	SIP	单列直插封装	SingleIn-line Package
17	SOM	中等宽度SOP	SmallOutline Middle Width Package
18	SOP	小外形封装	SmallOutline Package
19	SOT	小外形晶体管	Small Outlineof Transistors
20	SOW	宽体SOP	SmallOutline Package(Wide-type)
21	SSIP	窄节距单列直插封装	ShrinkSingle In-line Package
22	SSOP	窄间距小外形封装	ShrinkSmall-Outline Package
23	TO	晶体管封装	TransistorPackage
24	TQFP	薄四面扁平封装	ThinQuad Flat Package
25	TSSOP	窄节距薄小外形封装	ThinShrink Small Outline Package
26	TSOT	薄小外形晶体管	ThinSmall Outline of Transistors
27	VSOP	甚小外形封装	VerySmall Outline Package

冰点

海泉

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neil0404

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limuguitar

叶太平

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billye

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cnbdipz

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ks9527

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JRH1993

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