1. SCOPE
This test method is applicable to all solder ball surface mounted packages (e.g., PBGA, Chip Scale, Micro Lead Frame) except Flip Chip.
2. PURPOSE
The purpose of this test method is to define the procedure for measuring the shear strength of the interface between the barrier metal and solder ball. This method also establishes the minimum shear strength requirements for this interface.
車用電子零件分為三大類別,包含IC、離散半導體、被動元件三大類別,為了確保這些汽車電子零組件符合汽車安全的最高標準,美國汽車電子協會(AEC,Automotive Electronics Council )係以主動零件[微控制器與積體電路..等]為標的所設計出的一套標準 [AEC-Q100]、針對被動元件設計為[[AEC-Q200],其規範了被動零件所必須達成的產品品質與可靠度,AEC-Q100為AEC組織所制訂的車用可靠性測試標準,為3C&IC廠商打進國際車用大廠模組的重要入場卷